Dry Packing and Baking

Moisture Baking

Our moisture baking service ensures devices do not suffer defects during the soldering process. We can bake parts to specific customer instructions however industry standard times / temperatures range from 6 hrs 125deg C to 24 hrs at 125 deg C. Our baking procedures complies to 8 levels of moisture sensitivity in accordance with JEDEC standard J-STD-033A

Vaccuum Sealing and moisture barrier Bags

Coupled with our Baking service, we will seal product in a military specification Moisture Barrier Bag (MBB) together with moisture absorbent desiccant and a Humidity Indicator Card (HIC). The HIC measures the latent moisture within the bag which is used as a quality check when the bag is re-opened prior to the parts being used.

Our MBB's meet the requirements of the following standards:

EIA 541, EIA583 and MIL-PRF-81705D Type I, Class 1.
Desiccant meets the requirements of EIA Std. 583 and MILD-3464, Type I and II.
Our HIC cards meet the requirements of MIL-I-8835 and MIL-P-116 MTH II.

In addition:

Manufacturer dry bag conditions are recorded
Devices are re-sealed in vacuum packed hermetically sealed moisture barrier bags with humidity indicator card and the required unit of desiccant.
The total exposure time & level are recorded on the bag.
Lewmax production area is air-conditioned and humidity monitored to maintain the correct environment for your devices.