Dry Packing and Baking
Our moisture baking service ensures devices do not suffer defects during the soldering process. We can bake parts to specific customer instructions however industry standard times / temperatures range from 6 hrs 125deg C to 24 hrs at 125 deg C. Our baking procedures complies to 8 levels of moisture sensitivity in accordance with JEDEC standard J-STD-033A
Vaccuum Sealing and moisture barrier Bags
Coupled with our Baking service, we will seal product in a military specification Moisture Barrier Bag (MBB) together with moisture absorbent desiccant and a Humidity Indicator Card (HIC). The HIC measures the latent moisture within the bag which is used as a quality check when the bag is re-opened prior to the parts being used.
Our MBB's meet the requirements of the following standards:
EIA 541, EIA583 and MIL-PRF-81705D Type I, Class 1.
Desiccant meets the requirements of EIA Std. 583 and MILD-3464, Type I and II.
Our HIC cards meet the requirements of MIL-I-8835 and MIL-P-116 MTH II.
Manufacturer dry bag conditions are recorded
Devices are re-sealed in vacuum packed hermetically sealed moisture barrier bags with humidity indicator card and the required unit of desiccant.
The total exposure time & level are recorded on the bag.
Lewmax production area is air-conditioned and humidity monitored to maintain the correct environment for your devices.